Electronic component embedded substrate and method for manufacturing the same
US7420128B2 · kind B2 · utility
13Cited by
7References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2005 |
| Grant date | Sep 2, 2008 |
| Priority date | — |
| Expiry date | Jan 13, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic component embedded substrate and a method for manufacturing the substrate are disclosed. The electronic component embedded substrate includes a substrate main body and an electronic component embedded in the substrate main body. The center plane of the electronic component in the thickness direction thereof and the center plane of the substrate main body in the thickness direction thereof generally match each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.