Apparatus and method for testing semiconductor chip
US7420382B2 · kind B2 · utility
1Cited by
7References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2005 |
| Grant date | Sep 2, 2008 |
| Priority date | — |
| Expiry date | Apr 28, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R3/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus includes a test board for testing electrical characteristics of the semiconductor chip; socket pins vertically disposed on the test board to electrically connect the test board, and external terminals of the semiconductor chip; socket springs interposed between the socket pins and the test board and making the socket pins vertically elastic; a plurality of laser beam transmitters vertically penetrating the socket pins, the socket springs, and the test board; and a laser beam source supplying laser beams to the laser beam transmitters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.