Heat spreader in integrated circuit package
US7420809B2 · kind B2 · utility
30Cited by
18References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2004 |
| Grant date | Sep 2, 2008 |
| Priority date | — |
| Expiry date | Oct 13, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit (IC) package comprises a package substrate, an IC die mounted on the package substrate, a wire bond electrically connecting the IC die and the package substrate, and a heat spreader mounted on the package substrate. The heat spreader comprises a hole through a portion thereof. The IC die and the wire bond are disposed substantially between the heat spreader and the package substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.