Hong T. Lim
5Patents
3h-index
7Co-inventors
39Inventor score
Filing activity: Oct 12, 2001 → Sep 10, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7420809B2 | Heat spreader in integrated circuit package | Electricity | 30 | Expired |
| US6897555B1 | Integrated circuit package and method for a PBGA package having a multiplicity of staggered power ring segments for power connection to integrated circuit die | Electricity | 19 | Expired |
| US6687133B1 | Ground plane on 2 layer PBGA | Electricity | 7 | Expired |
| US6555914B1 | Integrated circuit package via | Electricity | 3 | Expired |
| US7235889B2 | Integrated heatspreader for use in wire bonded ball grid array semiconductor packages | Electricity | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.