On chip heating for electrical trimming of polysilicon and polysilicon-silicon-germanium resistors and electrically programmable fuses for integrated circuits
US7422972B2 · kind B2 · utility
7Cited by
7References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2005 |
| Grant date | Sep 9, 2008 |
| Priority date | — |
| Expiry date | Apr 5, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/47
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit programmable structure (60) is formed for use a trim resistor and/or a programmable fuse. The programmable structure comprises placing heating elements (70) in close proximity to the programmable structure (60) to heat the programmable structure (60) during programming.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.