Patent · US Active

Plastic overmolded packages with mechanically decoupled lid attach attachment

US7423341B2 · kind B2 · utility

6Cited by
4References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 16, 2006
Grant dateSep 9, 2008
Priority date—
Expiry dateFeb 6, 2027

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/1815
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

The specification describes a lidded MCM IC plastic overmolded package with chimney-type heat sink. The lid is mechanically decoupled from the chimneys by a compliant conductive polymer plug.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.