Wafer inspection device

US7424393B2 · kind B2 · utility

Assignee

• Vistec Semiconductor Systems GmbH · DE

Inventors

• Michael Halama · Wetzlar, DE
• Albert Kreh · Solms, DE
• Guenter Schmidt · Leun, DE

Key dates

• Filing date: May 12, 2004
• Grant date: Sep 9, 2008
• Expiry date: Jul 5, 2024

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/682
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor substrate or wafer inspection device for detecting defects on wafer surfaces includes an air-cushion stage which can be displaced in two directions (X,Y) that are perpendicular to one another. Several air nozzles are provided for this purpose. At least one valve is connected to at least one electric control unit, the valve being configured in such a way that a normal pressure prevails in the air nozzles when the electric control unit delivers a corresponding signal.