Method and apparatus for inspecting target defects on a wafer
US7426031B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 1, 2006 |
| Grant date | Sep 16, 2008 |
| Priority date | — |
| Expiry date | Mar 15, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/9501
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A defect inspecting apparatus includes a first support unit supporting a standard sample having standard defects, a second support unit supporting a wafer having target defects, a light source irradiating an incident light to the standard sample or the wafer, a light receiving part collecting reflection light reflected from the standard sample and the wafer, a detection part detecting the standard defects and the target defects by using the reflection light, a comparing part comparing information obtained using the reflection light reflected from the standard sample with a predetermined standard information of the standard defects to confirm a reliability of a step for detecting the target defects and a determination portion determining whether the step is allowed to be performed or not.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.