Patent · US Expired

Method of manufacturing a device having a contacting structure

US7427532B2 · kind B2 · utility

3Cited by

6References

20Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Norbert Seliger · Munich, DE
Karl Weidner · Birkenfeld, DE
Jörg Zapf · Munich, DE

Key dates

Filing date	Jan 23, 2004
Grant date	Sep 23, 2008
Priority date	—
Expiry date	Feb 12, 2025

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

According to the invention, a layer made of an electrically insulating material is applied to a substrate and a component that is arranged thereupon in such way that said layer follows the surface contour formed by the substrate and the component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.