Method of forming solder ball, and fabricating method and structure of semiconductor package using the same
US7427558B2 · kind B2 · utility
2Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2005 |
| Grant date | Sep 23, 2008 |
| Priority date | — |
| Expiry date | Dec 25, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/049
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming solder balls may involve forming bumps through wire boding on land patterns of a circuit substrate. Solder cream may be applied to the bumps through screen printing. The solder cream may be melted via reflow to form solder balls in which the bumps are embedded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.