Wha-Su Sin
11Patents
4h-index
11Co-inventors
49Inventor score
Filing activity: Aug 6, 2004 → Jul 13, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7420814B2 | Package stack and manufacturing method thereof | Electricity | 15 | Expired |
| US7235887B2 | Semiconductor package with improved chip attachment and manufacturing method thereof | Electricity | 7 | Expired |
| US7745932B2 | Semiconductor package, semiconductor package module including the semiconductor package, and methods of fabricating the same | Electricity | 6 | Active |
| US7576438B2 | Printed circuit board and method thereof and a solder ball land and method thereof | Electricity | 4 | Active |
| US7713788B2 | Method of manufacturing semiconductor package using redistribution substrate | Electricity | 2 | Active |
| US7427558B2 | Method of forming solder ball, and fabricating method and structure of semiconductor package using the same | Electricity | 2 | Expired |
| US8039972B2 | Printed circuit board and method thereof and a solder ball land and method thereof | Electricity | 1 | Active |
| US7452753B2 | Method of processing a semiconductor wafer for manufacture of semiconductor device | Electricity | 1 | Active |
| US7696615B2 | Semiconductor device having pillar-shaped terminal | Electricity | 0 | Active |
| US8115323B2 | Semiconductor package and method of manufacturing the semiconductor package | Electricity | 0 | Active |
| US7863161B2 | Method of cutting a wafer | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.