Method of making a heatsink device
US7428777B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2005 |
| Grant date | Sep 30, 2008 |
| Priority date | — |
| Expiry date | Mar 30, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and device for thermal conduction is provided. Methods of forming heatsinks are provided that include advantages such as the ability to produce intricate detailed features that other manufacturing methods are not capable of. Other advantages provided include a reduction in process time and cost due to the absence of a need to machine components after initial fabrication. Embodiments of heatsinks that are formed using methods provided include features such as sub-fins and other detailed features that cannot be formed using other manufacturing processes. Further embodiments of heatsinks that are formed using methods provided include materials that cannot be formed using other manufacturing processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.