Method of making a capacitive substrate using photoimageable dielectric for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate
US7429510B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 13, 2006 |
| Grant date | Sep 30, 2008 |
| Priority date | — |
| Expiry date | Apr 30, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0568
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming a capacitive substrate in which at least one capacitive dielectric layer of material is screen or ink jet printed onto a conductor and the substrate is thereafter processed further, including the addition of thru-holes to couple selected elements within the substrate to form at least two capacitors as internal elements of the substrate. Photoimageable material is used to facilitate positioning of the capacitive dielectric being printed. The capacitive substrate may be incorporated within a larger circuitized substrate, e.g., to form an electrical assembly. A method of making an information handling system including such substrates is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.