Methods and apparatus for integrated circuit device power distribution via internal wire bonds
US7429703B2 · kind B2 · utility
1Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 26, 2003 |
| Grant date | Sep 30, 2008 |
| Priority date | — |
| Expiry date | Nov 12, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit device comprising a die having a top surface with a peripheral region and an interior region surrounded by the peripheral region. Bond pads are disposed in the peripheral region of the die. One or more internal buses are disposed in the interior region of the die. The one or more internal buses distribute power to internal node points of the die. One or more bond wires connect one or more peripheral bond pads with one or more internal buses.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.