Multi-chip packaged integrated circuit device for transmitting signals from one chip to another chip
US7429794B2 · kind B2 · utility
3Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2005 |
| Grant date | Sep 30, 2008 |
| Priority date | — |
| Expiry date | Jul 28, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In a multi-chip packaged integrated circuit device for transmitting signals from one chip to another chip, in the case where not only a logic circuit of a first chip but also a logic circuit of a second chip requires an input signal, the multi-chip packaged integrated circuit device transmits the input signal to one or both of the logic circuits of the first and second chips via a synchronizer. In a case where three or more chips are integrated into the multi-chip packaged integrated circuit device, the input signal can be selectively transmitted to one or more of the three or more chips via the synchronizer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.