Methods and systems for analyzing a specimen using atomic force microscopy profiling in combination with an optical technique

US7430898B1 · kind B1 · utility

Assignee

• KLA-Tencor Technologies Corp. · US

Inventors

• Michael Weber-Grabau · Sunnyvale, US
• Christopher F. Bevis · Los Gatos, US
• Michael Faeyrman · Kiryat Motzkin, IL
• Ofir Zamir · Haifa, IL

Key dates

• Filing date: Sep 3, 2004
• Grant date: Oct 7, 2008
• Expiry date: Jan 1, 2026

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S977/881
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A system that includes an optical subsystem and an atomic force microscope probe is provided. The optical subsystem is configured to generate positional information about a location on a surface of the specimen. The system is configured to position the probe proximate the location based on the positional information. One method includes generating positional information about a location on a surface of a specimen with an optical subsystem. The method also includes positioning an atomic force microscopy probe proximate the location based on the positional information. Another system includes an optical subsystem configured to measure overlay of a wafer using scatterometry. The system also includes an atomic force microscope configured to measure a characteristic of a feature on the wafer. An additional method includes measuring overlay of a wafer using scatterometry. The method also includes measuring a characteristic of a feature on the wafer using atomic force microscopy.