Apparatus and method for removing photoresist from a substrate
US7431855B2 · kind B2 · utility
1Cited by
12References
36Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2003 |
| Grant date | Oct 7, 2008 |
| Priority date | — |
| Expiry date | Jan 7, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/906
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for removing photoresist from a substrate, which includes treating the photoresist with a first reactant to cause swelling, cracking or delamination of the photoresist, treating the photoresist with a second reactant to chemically alter the photoresist, and subsequently removing the chemically altered photoresist with a third reactant. In one example, the first reactant is supercritical carbon dioxide (SCCO2), the second reactant is ozone vapor, and the third reactant is deionized water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.