Substrate heat treatment apparatus
US7432476B2 · kind B2 · utility
469Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 3, 2006 |
| Grant date | Oct 7, 2008 |
| Priority date | — |
| Expiry date | Oct 11, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68735
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate heat treatment apparatus for heat-treating a substrate includes a bake plate having projections on an upper surface thereof, a seal unit disposed peripherally of the upper surface of the bake plate for closing a lateral area of a minute space formed between a lower surface of the substrate and the upper surface of the bake plate when the substrate is placed on the bake plate, and exhaust bores for exhausting gas from the minute space. The substrate placed on the bake plate is heat-treated in a state of the gas exhausted from the minute space through the exhaust bores.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.