Encapsulation of electronic devices with shaped spacers

US7432533B2 · kind B2 · utility

Assignees

• OSRAM GmbH · DE
• AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH · SG

Inventors

• Mark Auch · Singapore, SG
• Ewald Guenther · Regenstauf, DE
• Soo Jin Chua · Singapore, SG

Key dates

• Filing date: Sep 30, 2002
• Grant date: Oct 7, 2008
• Expiry date: Sep 30, 2022

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K59/8722

Abstract

An encapsulation for a device is disclosed. Spacer particles are randomly located in the device region to prevent a cap mounted on the substrate from contacting the active components, thereby protecting them from damage. The spacer particles comprise a base and an upper portion, the base being at least equal to or wider than the upper portion, for preventing the generation of dark spots around the spacer particles.