Semiconductor chip, electrically connections therefor
US7432594B2 · kind B2 · utility
9Cited by
0References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2005 |
| Grant date | Oct 7, 2008 |
| Priority date | — |
| Expiry date | Mar 31, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device has a semiconductor chip including first and second surfaces opposed to each other in a thickness direction of the semiconductor chip, wherein the first and second surfaces include first and second electrode surfaces respectively, and first and second electrically conductive members covering the first and second electrode surfaces respectively as seen in the thickness direction to be electrically connected to the first and second electrode surfaces respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.