Methods and apparatus for transferring a substrate carrier within an electronic device manufacturing facility
US7434676B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 13, 2007 |
| Grant date | Oct 14, 2008 |
| Priority date | — |
| Expiry date | Aug 13, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67276
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a first aspect, a first method is provided for electronic device manufacturing. The first method includes the steps of (1) receiving a request to transfer a carrier from a first substrate loading station to a second substrate loading station of an electronic device manufacturing facility including a plurality of substrate loading stations, wherein the facility further includes a plurality of carrier supports coupled to a conveyor system adapted to move the carrier within the facility; (2) assigning one of the plurality of carrier supports to transfer the carrier from the first substrate loading station to the second substrate loading station such that at least one of a time required for the transfer is reduced and balance of the conveyor system is maintained; (3) moving the carrier from the first substrate loading station; and (4) moving the carrier to the second substrate loading station. Numerous other aspects are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.