Multi-layer polishing pad material for CMP
US7435161B2 · kind B2 · utility
27Cited by
20References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 25, 2005 |
| Grant date | Oct 14, 2008 |
| Priority date | — |
| Expiry date | Feb 7, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/22
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention is directed to a multi-layer polishing pad for chemical-mechanical polishing comprising a porous polishing layer and a porous bottom layer, wherein the bottom layer is substantially coextensive with the polishing layer, the polishing layer being joined to the bottom layer without the use of an adhesive; the polishing layer having an average surface roughness, Ra, that is greater than the Ra of the bottom layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.