Multilayer printed circuit board
US7435910B2 · kind B2 · utility
36Cited by
34References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2004 |
| Grant date | Oct 14, 2008 |
| Priority date | — |
| Expiry date | Oct 27, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a transition layer 38 provided on a pad 24 of the IC chip 20. Due to this, it is possible to electrically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the transition layer 38 made of copper on the die pad 24, it is possible to prevent resin residues on the pad 24 and to improve connection characteristics between the pad 24 and a via hole 60 and reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.