MEMS microphone with a stacked PCB package and method of producing the same
US7436054B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 3, 2006 |
| Grant date | Oct 14, 2008 |
| Priority date | — |
| Expiry date | Apr 28, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A MEMS microphone with a stacked PCB package is described. The MEMS package has at least one MEMS acoustic sensor device located on a PCB stack. A metal cap structure surrounds the at least one MEMS acoustic sensor device wherein an edge surface of the metal cap structure is attached and electrically connected to the PCB stack. In a first embodiment, a back chamber is formed underlying the at least one MEMS acoustic sensor device and within the PCB stack wherein an opening underlying the at least one MEMS acoustic sensor device accesses the back chamber. An opening in the metal cap structure not aligned with the at least one MEMS acoustic sensor device allows external fluid, acoustic energy or pressure to enter the at least one MEMS acoustic sensor device. In a second embodiment, a back chamber is formed in the space under the metal cap and over the first PCB. A hollow chamber is formed between the first PCB and the second PCB wherein an opening under the at least one MEMS acoustic sensor device accesses the hollow chamber. An opening in a bottom surface of the PCB stack not aligned with the at least one MEMS acoustic sensor device also accesses the hollow chamber and allows extern…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.