Wang Zhe
12Patents
9h-index
3Co-inventors
57Inventor score
Filing activity: Oct 29, 2004 → Nov 8, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7436054B2 | MEMS microphone with a stacked PCB package and method of producing the same | Electricity | 100 | Active |
| US7202552B2 | MEMS package using flexible substrates, and method thereof | Electricity | 94 | Expired |
| US7329933B2 | Silicon microphone with softly constrained diaphragm | Electricity | 43 | Expired |
| US7346178B2 | Backplateless silicon microphone | Electricity | 40 | Active |
| US8178936B2 | Double-side mountable MEMS package | Electricity | 38 | Active |
| US7692288B2 | MEMS packaging method for enhanced EMI immunity using flexible substrates | Electricity | 23 | Active |
| US7843021B2 | Double-side mountable MEMS package | Electricity | 18 | Active |
| US8045733B2 | Silicon microphone with enhanced impact proof structure using bonding wires | Electricity | 18 | Active |
| US8045734B2 | Backplateless silicon microphone | Electricity | 15 | Active |
| US8013404B2 | Folded lead-frame packages for MEMS devices | Electricity | 4 | Active |
| US8467559B2 | Silicon microphone without dedicated backplate | Electricity | 4 | Active |
| US7999201B2 | MEMS G-switch device | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.