Reactive solder material
US7436058B2 · kind B2 · utility
5Cited by
25References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 9, 2002 |
| Grant date | Oct 14, 2008 |
| Priority date | — |
| Expiry date | May 9, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Reactive solder material. The reactive solder material may be soldered to semiconductor surfaces such as the backside of a die or wafer. The reactive solder material includes a base solder material alloyed with an active element material. The reactive solder material may also be applied to a portion of a thermal management device. The reactive solder material may be useful as a thermally conductive interface between a semiconductor surface and a thermal management device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.