Method of manufacturing and apparatus for a transmitter photonic integrated circuit (TXPIC) chip
US7437029B2 · kind B2 · utility
10Cited by
36References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 7, 2006 |
| Grant date | Oct 14, 2008 |
| Priority date | — |
| Expiry date | Apr 7, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/205
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A monolithic photonic integrated circuit (PIC) chip where the active waveguide cores of the modulated sources of the PIC are multiple quantum wells (MQWs) and the passive waveguide cores of an optical combiner are a bulk layer or material. The cores of the waveguide cores may be a quaternary such as InGaAsP or InAlGaAs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.