Resin encapsulation molding method for semiconductor device
US7439101B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 14, 2005 |
| Grant date | Oct 21, 2008 |
| Priority date | — |
| Expiry date | Jul 28, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to a resin encapsulation molding method for a semiconductor device, a resin-encapsulated substrate having a semiconductor device that is mounted on the substrate and that has a portion exposed is formed. With the method, a device-mounted substrate on which the semiconductor device is mounted is prepared and then the device-mounted substrate is set in one mold part. A release film is thereafter provided between the device-mounted substrate and the other mold part opposite to that one mold part. The one and other mold parts are then closed to press the release film against the portion of the semiconductor device. The device-mounted substrate has a projection enclosing the portion of the semiconductor device for preventing resin flash from being formed. When the mold parts are closed, the release film is pressed against the projection to allow the projection to dig into the release film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.