Capillary underflow integral heat spreader
US7439617B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2006 |
| Grant date | Oct 21, 2008 |
| Priority date | — |
| Expiry date | Jun 30, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1617
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling device including a thermally conductive body with a first mating surface, a first solder wettable material disposed in a pattern at a portion of the first mating surface, and a reflowable solder material disposed at the first mating surface. A portion of the solder material is configured to be capable of contacting an adjacently disposed second mating surface, and when melted, to form a single flow front through a bond line gap between the first mating surface of the cooling device and the second mating surface of, for example, a thermal component.A mating surface of the cooling device is positioned adjacent to a mating surface of a thermal component and the solder material is heated at least to its melting point. The solder material is maintained in a molten state until it has flowed into and substantially filled a bond line gap between the mating surface of the cooling device and the mating surface of the thermal component, and then cooled below its melting point, physically and/or thermally coupling the cooling device and the thermal component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.