Enhanced mechanical strength via contacts
US7439624B2 · kind B2 · utility
3Cited by
7References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 18, 2006 |
| Grant date | Oct 21, 2008 |
| Priority date | — |
| Expiry date | Jun 9, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides an enhanced interconnect structure with improved reliability. The inventive interconnect structure has enhanced mechanical strength of via contacts provided by embedded metal liners. The embedded metal liners may be continuous or discontinuous. Discontinuous embedded metal liners are provided by a discontinuous interface at the bottom of the via located within the interlayer dielectric layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.