Inventor · Delmar, NY, US

Kelly Malone

32Patents
7h-index
60Co-inventors
68Inventor score

Filing activity: Jul 18, 2002 → Jun 19, 2018

Most-cited inventions

PatentTitleAreaCited byStatus
US7711462B2 Vehicle help system and method Physics 27 Active
US7057287B2 Dual damascene integration of ultra low dielectric constant porous materials Electricity 20 Expired
US7084479B2 Line level air gaps Electricity 16 Expired
US9807087B2 Using an out-of-band password to provide enhanced SSO functionality Electricity 9 Active
US6831363B2 Structure and method for reducing thermo-mechanical stress in stacked vias Electricity 9 Expired
US8037095B2 Dynamic webcast content viewer method and system Emerging Cross-Sectional Technologies 9 Active
US10333927B2 Simulated SSO functionality by means of multiple authentication procedures and out-of-band communications Electricity 8 Active
US10144275B2 Environmental control in vehicles Physics 7 Active
US6783862B2 Toughness, adhesion and smooth metal lines of porous low k dielectric interconnect structures Emerging Cross-Sectional Technologies 7 Expired
US7816253B2 Surface treatment of inter-layer dielectric Electricity 5 Active
US7338895B2 Method for dual damascene integration of ultra low dielectric constant porous materials Electricity 4 Expired
US8099465B2 Method and system for preparing and replying to multi-party e-mails Electricity 4 Active
US10305882B2 Using a service-provider password to simulate F-SSO functionality Electricity 4 Active
US7737561B2 Dual damascene integration of ultra low dielectric constant porous materials Electricity 4 Active
USRE45781E1 Toughness, adhesion and smooth metal lines of porous low K dielectric interconnect structures General 4 Active
US7671470B2 Enhanced mechanical strength via contacts Electricity 4 Active
US9170296B2 Semiconductor device defect monitoring using a plurality of temperature sensing devices in an adjacent semiconductor device Physics 3 Active
US7187081B2 Polycarbosilane buried etch stops in interconnect structures Emerging Cross-Sectional Technologies 3 Expired
US7396758B2 Polycarbosilane buried etch stops in interconnect structures Emerging Cross-Sectional Technologies 3 Active
US7439624B2 Enhanced mechanical strength via contacts Electricity 3 Active
US6764873B2 Semiconductor wafer including a low dielectric constant thermosetting polymer film and method of making same Emerging Cross-Sectional Technologies 2 Expired
US8637412B2 Process to form an adhesion layer and multiphase ultra-low k dielectric material using PECVD Electricity 2 Active
US8647535B2 Conductive metal and diffusion barrier seed compositions, and methods of use in semiconductor and interlevel dielectric substrates Emerging Cross-Sectional Technologies 2 Active
US7933592B2 Cellular telephone signal monitoring method and system Electricity 2 Active
US7670943B2 Enhanced mechanical strength via contacts Electricity 2 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.