Methods and apparatuses for high-performing multi-layer inductors
US7439840B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2006 |
| Grant date | Oct 21, 2008 |
| Priority date | — |
| Expiry date | Aug 23, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4902
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present invention may provide for high-performing inductor structures utilizing multi-layer organic stackups. In particular, these high-performing inductor structures may be formed of one or more stitched metal layer building blocks, which are each formed of at least two inductor sections that are vertically or horizontally aligned, and then stitched or connected together. This stitching process significantly reduces the DC/RF losses while reducing the inductance value by a substantially lower factor, thereby significant increasing the Q-factor of the resulting inductor structure. Each stitched metal layer building block may be formed on an organic dielectric layer (e.g., liquid crystalline polymer (LCP)) having a first conductive layer on a first surface and perhaps a second conductive layer on a second surface opposite the first surface. The at least two inductor sections described above may be formed by patterning or circuitizing the first conductive layer and/or the second conductive layer. Additional stitched metal layer building blocks may be stacked with at least one organic laminate layer (e.g., LCP) disposed between each pair of stitched metal layer buil…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.