George E. White
26Patents
15h-index
32Co-inventors
81Inventor score
Filing activity: Mar 8, 1985 → Aug 11, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5549808A | Method for forming capped copper electrical interconnects | Emerging Cross-Sectional Technologies | 65 | Expired |
| US7795995B2 | Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications | Electricity | 54 | Active |
| US5757079A | Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages and the resulting MLTF structure | Electricity | 53 | Expired |
| US5898222A | Capped copper electrical interconnects | Electricity | 51 | Expired |
| US6900708B2 | Integrated passive devices fabricated utilizing multi-layer, organic laminates | Electricity | 50 | Expired |
| US5534466A | Method of making area direct transfer multilayer thin film structure | Emerging Cross-Sectional Technologies | 40 | Expired |
| US6987307B2 | Stand-alone organic-based passive devices | Electricity | 34 | Expired |
| US7068124B2 | Integrated passive devices fabricated utilizing multi-layer, organic laminates | Electricity | 33 | Expired |
| US7489914B2 | Multi-band RF transceiver with passive reuse in organic substrates | Electricity | 32 | Active |
| US5545927A | Capped copper electrical interconnects | Electricity | 28 | Expired |
| US4616522A | Steering column energy absorbing release bushing and deforming bracket | Performing Operations; Transporting | 28 | Expired |
| US8345433B2 | Heterogeneous organic laminate stack ups for high frequency applications | Electricity | 25 | Active |
| US7260890B2 | Methods for fabricating three-dimensional all organic interconnect structures | Emerging Cross-Sectional Technologies | 23 | Expired |
| US8013688B2 | Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications | Electricity | 21 | Active |
| US6444919B1 | Thin film wiring scheme utilizing inter-chip site surface wiring | Electricity | 16 | Expired |
| US5747095A | Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages | Electricity | 15 | Expired |
| US7808434B2 | Systems and methods for integrated antennae structures in multilayer organic-based printed circuit devices | Electricity | 13 | Active |
| US7989895B2 | Integration using package stacking with multi-layer organic substrates | Electricity | 13 | Active |
| US5705857A | Capped copper electrical interconnects | Electricity | 12 | Expired |
| US7439840B2 | Methods and apparatuses for high-performing multi-layer inductors | Emerging Cross-Sectional Technologies | 10 | Active |
| US6225035A | Method for forming a thick-film resistor | Electricity | 9 | Expired |
| US5464682A | Minimal capture pads applied to ceramic vias in ceramic substrates | Emerging Cross-Sectional Technologies | 9 | Expired |
| US7805834B2 | Method for fabricating three-dimensional all organic interconnect structures | Emerging Cross-Sectional Technologies | 6 | Active |
| US5483105A | Module input-output pad having stepped set-back | Emerging Cross-Sectional Technologies | 5 | Expired |
| US5916451A | Minimal capture pads applied to ceramic vias in ceramic substrates | Emerging Cross-Sectional Technologies | 4 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.