Concept of compensating for piezo influences on integrated circuitry

US7440861B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Udo Ausserlechner · Villach, AT
• Mario Motz · Wernberg, AT

Key dates

• Filing date: Dec 5, 2007
• Grant date: Oct 21, 2008
• Expiry date: Dec 5, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

The inventive circuitry on a semiconductor chip includes a first functional element having a first electronic functional-element parameter that exhibits a dependence relating to the mechanical stress present in the semiconductor circuit chip in accordance with a first functional-element stress influence function. The first functional element provides a first output signal based on the first electronic functional-element parameter and mechanical stress. A second functional element has a second electronic functional-element parameter that exhibits a dependence in relation to the mechanical stress present in the semiconductor circuit chip in accordance with a second functional-element stress influence function. The second functional element is configured to provide a second output signal based on the second electronic functional-element parameter and the mechanical stress. A combiner combines the first and second output signals to obtain a resulting output signal exhibiting a predefined dependence on the mechanical stress present in the semiconductor circuit chip.