Fabrication process circuit board with embedded passive component
US7441329B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 3, 2005 |
| Grant date | Oct 28, 2008 |
| Priority date | — |
| Expiry date | Oct 12, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for fabricating a circuit board with embedded passive component is provided. A conductive layer including a first surface and a second surface opposing to the first surface is provided. The conductive layer has first through holes passing through the conductive layer, respectively. At least one passive component material layer is formed on the first surface. A circuit unit including second through holes is provided. Locations of the second through holes are corresponding to the locations of the first through holes, respectively. The conductive layer and the circuit unit are aligned by the first through holes and the second through holes, while the first surface of the conductive layer faces the circuit unit, and the passive component material layer is between the circuit unit and the conductive layer. The conductive layer is laminated to the circuit unit. The conductive layer is patterning to form a circuit layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.