Patent · US Active

Method for producing a chip-substrate connection

US7442582B2 · kind B2 · utility

4Cited by

25References

18Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Hans-Jörg Reichert · Birkenfeld, DE
Margarete Deckers · Hersbruck, DE
Rainer Zanner · Birkenfeld, DE

Key dates

Filing date	Aug 21, 2007
Grant date	Oct 28, 2008
Priority date	—
Expiry date	Aug 21, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/351
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method and an apparatus for producing a chip-substrate connection by alloying or brazing, using a solder containing two or more components with at least two metal-containing constituents X and Y. The first constituent X contains in particular gold or a similar precious metal, and the second constituent Y being consumed in the soldering operation by reacting or being dissolved in the materials or layers which are to be joined. The solder has a hypereutectic concentration of the second constituent Y. The invention furthermore relates to a solder for the production of a chip-substrate connection, and to a semiconductor component with a semiconductor chip which is secured to a substrate by alloying or brazing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.