Circuitized substrate with solder-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate
US7442879B2 · kind B2 · utility
15Cited by
16References
40Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2005 |
| Grant date | Oct 28, 2008 |
| Priority date | — |
| Expiry date | Feb 3, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1152
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuitized substrate which includes a conductive paste for providing electrical connections. The paste, in one embodiment, includes a binder component and at least one metallic component including microparticles. In another embodiment, the paste includes the binder and a plurality of nano-wires. Selected ones of the microparticles or nano-wires include a layer of solder thereon. A method of making such a substrate is also provided, as are an electrical assembly and information handling system adapter for having such a substrate as part thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.