Manufacturing method of semiconductor device
US7443036B2 · kind B2 · utility
9Cited by
4References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2005 |
| Grant date | Oct 28, 2008 |
| Priority date | — |
| Expiry date | Mar 22, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The manufacturing method of the semiconductor device of the present invention has a step forming solder balls on the circuit face of a mother chip, a step making flip chip bonding of the daughter chip after the step forming solder balls on the circuit face of the mother chip, and a step making flip chip bonding of the mother chip on a circuit board using the solder balls.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.