Patent · US Expired

Apparatus and methods for constructing antennas using vias as radiating elements formed in a substrate

US7444734B2 · kind B2 · utility

17Cited by

13References

10Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Brian P. Gaucher · Brookfield, US
Duixian Liu · Yorktown Heights, US
Ullrich R. Pfeiffer · Wolfsburg, DE
Thomas Zwick · Leutkirch im Allgäu, DE

Key dates

Filing date	Dec 9, 2003
Grant date	Nov 4, 2008
Priority date	—
Expiry date	Dec 27, 2024

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49018
WIPO fieldTelecommunications
WIPO sectorElectrical engineering

Abstract

Antennas are provided which are constructed using one or more conductive via stubs as radiating elements formed in a substrate. The antennas can be integrally packaged with IC chips (e.g., IC transceivers, receivers, transmitters, etc.) to build integrated wireless or RF (radio frequency) communications systems.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.