Semiconductor device and method of manufacturing the same
US7445964B2 · kind B2 · utility
2Cited by
5References
29Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Dec 13, 2006 |
| Grant date | Nov 4, 2008 |
| Priority date | — |
| Expiry date | Dec 13, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes at least one semiconductor structure which has a plurality of external connection electrodes formed on a semiconductor substrate. An insulating sheet member is arranged on the side of the semiconductor structure. Upper interconnections have connection pad portions that are arranged on the insulating sheet member in correspondence with the upper interconnections and connected to the external connection electrodes of the semiconductor structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.