Semiconductor device and method for assembling the same
US7446423B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 14, 2003 |
| Grant date | Nov 4, 2008 |
| Priority date | — |
| Expiry date | May 20, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/959
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a semiconductor device provided with a thinned semiconductor element, the present invention intends to inhibit damage of the semiconductor element in the neighborhood of its outer periphery so as to improve reliability. A plurality of external connection terminals are formed on a front surface of the thinned semiconductor element. A plate higher in rigidity than the semiconductor element is adhered with a resin binder to a rear surface of the semiconductor element. An outer shape of the plate is made larger than that of the semiconductor element, and the resin binder covers a side face of the semiconductor element to form a reinforcement portion for reinforcing a periphery of the semiconductor element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.