Apparatus and method for reducing contamination in immersion lithography
US7446859B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2006 |
| Grant date | Nov 4, 2008 |
| Priority date | — |
| Expiry date | Oct 19, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68735
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An apparatus for reducing contamination in immersion lithography includes a wafer chuck assembly having a wafer chuck configured to hold a semiconductor wafer on a support surface thereof. The wafer chuck has a gap therein, the gap located adjacent an outer edge of the wafer, and the gap containing a volume of immersion lithography fluid therein. A fluid circulation path is configured within the wafer chuck so as to facilitate the radial outward movement of the immersion lithography fluid in the gap, thereby maintaining a meniscus of the immersion lithography fluid at a selected height with respect to a top surface of the semiconductor wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.