Compression connection for vertical IC packages
US7447041B2 · kind B2 · utility
1Cited by
9References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2007 |
| Grant date | Nov 4, 2008 |
| Priority date | — |
| Expiry date | Mar 1, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved vertical integrated circuit device package that eliminates or reduces the need for wire bond connections and/or solder connections is provided. The package includes a vertical device having electrodes on opposite surfaces, and a compressed spring member that is used to establish compression electrical connections between the electrodes and corresponding electrically conductive elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.