Shing Yeh
15Patents
9h-index
19Co-inventors
69Inventor score
Filing activity: Aug 31, 1994 → Apr 30, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5607099A | Solder bump transfer device for flip chip integrated circuit devices | Electricity | 183 | Expired |
| US6062461A | Process for bonding micromachined wafers using solder | Performing Operations; Transporting | 115 | Expired |
| US5803340A | Composite solder paste for flip chip bumping | Electricity | 102 | Expired |
| US6281106A | Method of solder bumping a circuit component | Emerging Cross-Sectional Technologies | 66 | Expired |
| US5491364A | Reduced stress terminal pattern for integrated circuit devices and packages | Emerging Cross-Sectional Technologies | 35 | Expired |
| US6251501A | Surface mount circuit device and solder bumping method therefor | Emerging Cross-Sectional Technologies | 33 | Expired |
| US6767411B2 | Lead-free solder alloy and solder reflow process | Performing Operations; Transporting | 19 | Expired |
| US5938862A | Fatigue-resistant lead-free alloy | Chemistry; Metallurgy | 16 | Expired |
| US6811892B2 | Lead-based solder alloys containing copper | Emerging Cross-Sectional Technologies | 10 | Expired |
| US6630251B1 | Leach-resistant solder alloys for silver-based thick-film conductors | Emerging Cross-Sectional Technologies | 7 | Expired |
| US6570260B1 | Solder process and solder alloy therefor | Electricity | 4 | Expired |
| US7726972B1 | Liquid metal rotary connector apparatus for a vehicle steering wheel and column | Electricity | 2 | Active |
| US10600206B2 | Tracking system and method thereof | Physics | 1 | Active |
| US6619536B2 | Solder process and solder alloy therefor | Electricity | 1 | Expired |
| US7447041B2 | Compression connection for vertical IC packages | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.