System and method for sorting processors based on thermal design point
US7447602B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2007 |
| Grant date | Nov 4, 2008 |
| Priority date | — |
| Expiry date | Jun 5, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/31718
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system and method for sorting processor chips based on a thermal design point are provided. With the system and method, for each processor chip, a high power workload is run on the processor chip to determine a voltage regulator module (VRM) load line. Thereafter, a thermal design point (TDP) workload is applied to the processor chip and the voltage is varied until a performance of the processor chip falls on the VRM load line. At this point, the power input to the processor chip is measured and used to sort, or bin, the processor chip. The various workloads applied have a constant frequency. From this sorting of processor chips, high speed processors that require less voltage to achieve a desired frequency and low current processors that drain less current while running at a desired frequency may be identified.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.