Capacitance dual electrode pressure sensor in a diffusion bonded layered substrate
US7448276B2 · kind B2 · utility
9Cited by
25References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2006 |
| Grant date | Nov 11, 2008 |
| Priority date | — |
| Expiry date | Aug 23, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49906
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A diffusion bonded space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The disclosure includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. A capacitive dual electrode pressure sensor which is integrated into a multilayered substrate is described. The pressure sensor may be used as a gage relative to atmospheric pressure if desired for a particular application.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.