Patent · US Expired

Optical subassembly and projection objective in semiconductor lithography

US7448763B2 · kind B2 · utility

2Cited by

16References

29Claims

0Family size

Assignee

Carl Zeiss SMT GmbH · DE

Inventors

Andreas Frommeyer · Schwäbisch Gmünd, DE
G Fraser Morrison · Aalen, DE
Wolfgang Keller · Munich, DE
Yim-Bun Patrick Kwan · Aalen, DE
Harald Kirchner · Munich, DE
Willi Heintel · Aalen, DE

Key dates

Filing date	Dec 3, 2003
Grant date	Nov 11, 2008
Priority date	—
Expiry date	Jun 1, 2024

Classification

Technology area (CPC G)Physics
CPC primaryG02B7/182
WIPO fieldOptics
WIPO sectorInstruments

Abstract

An optical subassembly with an optical element, for example a mirror element (7), has an optical surface (9) and bearing points (12) arranged on the circumference. The optical element (7) is connected to a mount (13) at the bearing points (12) via connecting elements (14, 15, 16, 17, 18). Stress-decoupling cutouts, for example curved slots (11), are provided between the optical surface (9) and the bearing points (12).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.