Scatterometry target for determining CD and overlay
US7449265B1 · kind B1 · utility
8Cited by
0References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 20, 2007 |
| Grant date | Nov 11, 2008 |
| Priority date | — |
| Expiry date | Nov 20, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70633
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The invention can provide a method of processing a wafer using segmented multi-dimensional targets that can be used in Double-Patterning (D-P) procedures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.