Method of making a capacitive substrate for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate
US7449381B2 · kind B2 · utility
6Cited by
20References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 13, 2006 |
| Grant date | Nov 11, 2008 |
| Priority date | — |
| Expiry date | Mar 26, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0568
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming a capacitive substrate in which at least one capacitive dielectric layer of material is screen or ink jet printed onto a conductor and the substrate is thereafter processed further, including the addition of thru-holes to couple selected elements within the substrate to form at least two capacitors as internal elements of the substrate. The capacitive substrate may be incorporated within a larger circuitized substrate, e.g., to form an electrical assembly. A method of making an information handling system including such substrates is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.