Method and system for the optical inspection of contact faces at semiconductor devices with different appearances
US7449903B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 6, 2006 |
| Grant date | Nov 11, 2008 |
| Priority date | — |
| Expiry date | Dec 9, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system and method is provided that reliably determines the position of contact needle tips on a contact pad irrespective of the contact pad geometry and the character of the contact pad surface. For example, optical recognition of the surface of the contact pad is completed prior to contacting the contact pad by the contact element and generating a reference image. Optical recognition of the surface of the contact pad is completed after contacting of the contact pad by the contact element when generating the image to be analyzed. A difference between the reference image and the image to be analyzed is taken, and the resulting image is analyzed for recognized contrasts or impressions left by the contact element on the contact pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.